电路层数

10层

2层

2层

2层

板子最大尺寸

200*200mm

138*178mm

138*190mm

114*114mm

最小板厚

0.25mm

0.30mm~0.40mm

0.25mm

0.25mm

最大板厚

2.0mm

1L: 1.3mm; 2L: 1.6mm

2.0mm

1.8mm

导体厚度

5um-13um

3.9oz-8.6oz

2um-200um

8oz-22.9oz

最小线宽/线距

6/8mil (0.15/0.20mm)

12/12mil (0.30/0.30mm)

6/8mil (0.15/0.20mm)

20/20mil (0.50/0.50mm)

基材类型

氧化铝，氮化铝，氧化铍，氧化锆

氧化铝，氮化铝，氧化锆

氧化铝，氮化铝，氧化锆，氮化硅

氮化铝，氮化硅

基材厚度

0.25, 0.38, 0.50, 0.635, 0.80,
1.0, 1.25, 1.5, 2.0mm

0.25, 0.38, 0.50, 0.635, 0.76,
1.0mm

0.25, 0.38, 0.50, 0.635, 0.80,
1.0, 1.25, 1.5, 2.0mm

0.25, 0.38, 0.50, 0.635, 0.76,
1.0mm

最小孔径

4mil (0.1mm)

最小孔距

NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)

最小PAD环 （单个）

6mil (0.15mm)

N/A

3mil (0.075mm)

N/A

PTH最小孔壁铜厚

4mil (10um)

N/A

4mil (10um)

N/A

焊锡焊盘最小直径

10mil (0.25mm)

8mil (0.20mm)

6mil (0.15mm)

8mil (0.20mm)

最小组焊桥

12mil (0.30mm)

8mil (0.20mm)

6mil (0.15mm)

8mil (0.20mm)

BGA焊盘最小间距

12mil (0.30mm)

8mil (0.20mm)

5mil (0.125mm)

8mil (0.20mm)

PTH/NPTH孔径公差

PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)

孔偏位公差

± 4mil (0.1mm)

外形公差

激光切割: +0.2/0.05mm;
模具冲型: +0.25/0.20mm

激光切割: +0.2/0.05mm

激光切割: +0.2/0.05mm;
模具冲型: +0.25/0.20mm

激光切割: +0.2/0.05mm

线宽/线距公差

± 5mil (0.125mm)

± 5mil (0.125mm)

± 1mil (0.025mm)

± 5mil (0.125mm)

表面处理

AgPd, AuPd, Mn/Ni

OSP抗氧化/镀镍, 沉金

OSP抗氧化/沉金/镍钯金

OSP抗氧化/镀镍, 沉金

热应力

1 hour @ 350℃

3 x 10 Sec @ 280 ℃

15 min @ 350 ℃

3 x 10 Sec @ 280 ℃